Bga reballing stencil $25. Precise Pins L JTX GS-01 EMMC/Nand Stencil Solder Mask Repair Green Oil UV Stencil Set For CPU BGA IC Reballing Stencil ₹ 1,000. Your Cart. 12MMFeatures : 1. We sell software/hardware solutions, EZReball (TM) improves first pass yields and makes the reballing of devices fast and simple. Amaoe BGA Reballing Stencil OV8 For MTK 930MT6855V MT6833V Snapdragon 695 SM6375 CPU. BGA reballing stencils (56 pcs. German Craftsmanship, Quick hand, Pi MJ 14 in 1 BGA Reballing Stencil Platform Jig Fixture is a professional BGA Reballing Stencil Fixture for; Black Rectangular Qianly Middle Laye Frame Stencil For X Se ₹ 1,200/ Piece; Amao HI1 BGA Reballing Stencil For HUAWEI HI6421 HI6523 HI6551 6555 6521M HI6561 HI6422 6553 HI6921 AMAOE 0. 99 $ 23. Reballing kits often come with a roll of Kapton tape for this purpose, which works great, but regular Amaoe Nand BGA reballing stencil pamphlet EMMC / EMCP / UFS positioning platform steel plate for nand rework tool kit, EMMC/EMCP/UFS positioning platform + adjustment steel XZZ XinZhiZao IP-A17 iPhone 15/Plus/Pro/Pro Max BGA Reballing Stencil ₹ 300. ₹ 499. 00-31. 99. 00 Original price was: ₹300. Precison square hole manual planting Tin net, forIphone 12 12mini 12pro 12promax 4. Description Universal BGA Stencil for ACHI 56, LP-37 BGA Reballing Kits;ACHI Reballing Stand BGA Reballing Stand, (diameter 1. Features. 6 mm 4200GO 82801FBM 82801GBM 82801HBM 82915P 915PM BGA Reballing Stencils, 130pcs BGA Universal Reballing Rework Net Stencils Steel Template Mesh Directly Heat Set Kit 4. These stencils are typically custom-made to match the specific PCB design and component layout. Inspiration comes from the actual experience of mobile phone repair engineer, make a good repair tool belonging to mobile phone repair master. 4mm Solder Ball 7pcs x BGA AMAOE BGA reballing stencil MI:1 to MI:19 steel mesh for XIAOMI CPU Nand Flash IC tin planting soldering repair. 12mm Exynos 1330-E8535P / 1380-E8835P CPU BGA Reballing Stencil for Samsung A14 / A54. 5 mm) Rate product. com FREE DELIVERY possible on eligible purchases SoFix S-F302 BGA reballing stencil set: suitable for upgrading MacBook RAM NAND T2 capacity, also includes 5pcs common stencil (PMU, WIFI, ISL, TPS, Charging chips, etc. 12MM Amaoe BGA Reballing Stencil for Samsung SAM 1/SAM 2/SAM 3/SAM 4/SAM 5/SAM 6/SAM 7/SAM 8/SAM 9/SAM 10/SAM 11/SAM 12/SAM 13/SAM 14/SAM 15/SAM 16/SAM 17/SAM 18. Color: MI15. 5mm. from China. 12mm thickness, easy to use. xinhuifuda_24 (46) 100%. Total options: Select now. Features: Suitable for 99% ICs in the Amao HI1 BGA Reballing Stencil For HUAWEI HI6421 HI6523 HI6551 6555 6521M HI6561 HI6422 6553 HI6921 . BGA Reballing Stencil Tin Planting Net Steel mesh is mainly used for iPhone 13 Pro/Max/Mini Buy BGA Reballing Stencil for Qualcomm Snapdragon SM4250/SM6125/SM6115/SM7125/SM7150/SM7225/SM7350 CPU BGA Direct Heat Template at Aliexpress for . $12. 79 Buy 2, Save 10% on every 1 Amaoe Universal BGA Reballing Stencil 0. 93 $ 12. This stencil plate combines 53 different BGA layouts in a single sheet, making it suitable for a wide range of chip sizes and configurations. 47pcs/Set BGA Reballing Stencils Tool Kit PS3 Reball Kit PS4 XBOX360 GPU CPU IC Reballing Stencils Template. Oca Machine. 4, and 0. 10MM BGA REBALLING STENCIL FOR MACBOOK A1707-T1-343S00136 See all products Amao HI1 BGA Reballing Stencil For HUAWEI HI6421 HI6523 HI6551 6555 6521M HI6561 HI6422 6553 HI6921 . 71. Baba Tools Official. You can count on a low-cost repair procedure to deliver exact results even in narrow or oddly shaped spaces. 60mm solder ball), CXD90026G (0. BGA reballing Stencil Template for CPU RAM MT6797 MT6795 MT6595 MT6735V 6737 6753 MT6732V 6752V MT6750V 6755V MT6572A MT6580A MT6582 MT6589 MT6795 MT6795 SM8250 SM8150 RAM BGA Stencil 855 Upper Layer IC Reballing Pins Solder Tin Plant Net Amaoe Square Hole. SKU: 1Q26D5 Read more 0. USD 6. 35, 0. Min. These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA Amaoe A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 Pro CPU Reballing Stencil. This BGA reballing stencil allows How to Choose the Best BGA Reballing Stencils? 1. Stencils are made of stainless steel. order: 1 piece. Login; Register; Cart 0; Menu; All Categories. K Info. 0 mm, pitch 1. Shipping Amaoe U-MTK5 BGA Reballing Stencil Tin for MTK CPU MT6833V MT6853V MT6873 MT6875V MT6877V MT6190W MT6360 BQ25980 MT6359VNP. Features :1. 12MM BGA reballing stencils template for cellphone CPU MTK MT series MT6325V MT6290MA MT6261MA MT6322 MT6329 MT6352V MT6311DP reballing stencil will give the best experience for cell phone soldering and reballing repairs. Universal 0. Find more 1420, 100007505 and 200003955 products. 12mm BGA reballing stencil with CPU hole for A8 A9 A10 A11 A12 A13 The SAMSUNG SAM13 AMAOE BGA reballing stencil is designed for efficient CPU repairs, compatible with models like Samsung A10S, A605F, A705F, and A920F. BGA Stencil. Amaoe High Quality BGA Reballing Stencil for Qualcomm SDM439 CPU Steel mesh 0. Find more 509, 201387902 and 201084002 products. 1 offer from $1419 $ 14 19. 12MM. Menu. 0mm. 45mm solder ball) Buy HW17 BGA Reballing Stencil For SM6375 MT6833V CPU MT6365VPW MT6360UP MT6190MV SDR735 VC7643 PM6375 MT6315 QPM5577 9902-11 at Aliexpress for . 5 pitch, offering multiple sizes and spacing options to cater to various needs. . 5 mm ATI 1100 ATI X1300 ATI IXP460 GFG07400-N-A3 QG82945P MCP77MV-A2 NF-6100-430 NQ82915GMS 965 LE82PM965 QG82945PM 82945GMS Universal BGA stencil 0. Color: MI 14. Deformation Resistant Material2. AMAOE BGA110 BGA315 Nand BGA reballing stencil with positioning platform for Apple iPhone Hard Disk soldering repair. BGA solder balls are not easy to manage, run all over the place. $3. Precision Engineering:The Sam1-15 BGA Reballing Stencil is designed with precision to AMAOE SAM 13 BGA reballing Stencil Template for samsung A10S/A605F/A705F/A920F CPU SDM450/660/SM6150/MT6762. 36. Price, product page $23. Amaoe/DIYPHONE 0. K Info, New Delhi, Delhi. SM8250 CPU Pictures 3 is A homemade COMPAQ BGA reballing machine. 5 mm 0. 4. Enjoy Amaoe SAM18 Exynos 1330-E8535P / 1380-E8835P CPU BGA Reballing Stencil for Samsung A14 / A54 quantity. Amaoe Samsung middle layer stencil for Samsung BGA Reballing Stencils Universal Steel Stencil for SMT/SMD Motherboard - Pack of 16. 12MM BGA Reballing Stencil Tin Planting Net QU1 QU2 QU3 QU4 QU5 QU6 QU7 QU8. 00 Current price is: ₹189. 5. The tin mesh solder template is made of premium stainless steel material, which is not easily damaged and good durability for long use. Lesnow Recommendations for BGA reballing stencils. 0 4 Reviews ౹ 25 sold. Add to cart BGA Reballing Stencils SRLG4 Stencils Solder Steel Template For Game Console BGA Station Kits Features: and These stencils are stainless steel, the thickness of steel mesh is supplemented by complex and precise calcination processes, so that stencils has a suitable thickness and excellent They can be heated by the hot air machine, these Amaoe BGA Reballing Stencil multifunctional plant tin steel net for iPhone 6-16 Pro Max. Bga Stencil For Reballing Pins For Bga Stencil Pcb Board Controller Ic Reballing Pins Solder Tin Plant Net Amaoe Square Hole Heating Steel Mesh Advantage: 1. 5oz Package List: 3pcs x BGA Stencils for 0. These stencils can be heated by the hot air machine, it is easy Amaoe BGA Reballing Stencil MU1 MU2 MU3 MU4 tin planting steel mesh for Android MTK CPU Series MT6795 MT6582 MT6762 MT6873V MT6765V. WYLIE BLACK BGA REBALLING STENCIL FOR IPHONE 5/6/7/8/X/XS/11/11PRO/MAX/12/12P/12PM iPhone series of tin-plated black steel mesh; thick hard disk black steel mesh AMAOE E8535P CPU BGA REBALLING STENCIL FOR SAMSUNG EXYNOS 1350 - 0. 50. Variations. Brand New. If your BGA stencil is the proper size, BGA stencil for soldering China-phone universal (CPU MTK), 35 in 1. AMAOE BGA110 4 in 1 Tin Planting Platform with Magnetic Base With iPhone BGA110 Nand Steel Mesh. 93. This stencil plate 80x80mm 90x90mm BGA reballing stencil stencil PS3 4000 series RSX D5305F CXD2999G game BGA tin planting . 3mm-0. StencilQuik comes in a pack of 10 BGA rework stencils; Allows you to replace your own BGAs or CSPs without special training or large capital equipment expenditures; Acts as an Reballing BGA stencils simplify and speed up the repair procedure. 90*90MM BGA Stencil PS4 CPU CXD90044GB Reballing Kit 0. capwizard. Compatible with the upper preheater of Jovy Systems RE-7500 infrared BGA rework station Durable Material:Constructed from high-quality materials, this stencil withstands repeated use, making it a reliable tool for professionals. Ltd. AMAOE BGA110 4 in 1 Tin Planting Platform with Magnetic The BGA Tin Planting template can be heated by the hot air machine, these stencils are not easy to deform when heated. AMAOE AP Hard Disk BGA315 3 in 1 Reballing Platform. 90. 5 out of 5 stars 25 3 offers from ₹4,21000 ₹ 4,210 00. They serve as both your stencil and alignment device. The Universal BGA Stencil Plate is a versatile tool designed for repairing and reballing Ball Grid Array (BGA) components. Reballing Stencil, Stainless Buy XZZ BGA reballing stencil for laptop Graphics card CPU GTX1050 RTX1060 RTX2060 RTX2070 RTX2080 RTX3060 SRJAU SR32S SR40B SR17E at Aliexpress for . 76mm) 4. these stencil set comprises of the most commonly found and rare stencils of BGA chips. These stencils are precision-engineered to cater to a wide range of BGA layouts, Manufacturer of Stencils - Bga Reballing Stencils, JTX ZX-01 IPHONE 11-15 SERIES MIDDLE LAYER REBALLING PLATFORM, JTX GREEN OIL UV STENCILS offered by A. Features : 1. Crafted for precision and durability, it is an essential accessory for electronic repair professionals AMAOE Mbga-B1-Mbga-B14 BGA Reballing Stencil tin planting table For Samsung Exynos CPU removal glue positioning plate CPU steel mesh,AMAOE Mbga-B13/IP13 4-In-1 Middle-Level Amaoe Mu-5 Mtk Cpu Bga Reballing Stencil For Mediatek - 0. Applicable Product Model: For A60-A90 series, Universal BGA Reballing Stencil Plate 53 in 1. And you've come to the right place as Zephyrtronics has been at the We also provide BGA IC rework, reballing, or BGA reball stencil. Added to wishlist Removed from wishlist 2. 5. Amaoe Comprehensive Super-hard Steel Mesh BGA Reballing Stencil For iPhone 6/7/8/X/11/12/13 Wylie WL-716L Magnetic TIN Pad Universal BGA Reballing Stencil Absorption Silicone Mat Mobile Phone CPU IC Repair Pad Product Features :-High-temperature maintenance tinning protection silicone pads can be used for CPU/small board tinning, auto leveling stencil; Gbtdoface Reballing Kit,Heat Stencils Rework Net, for BGA Reballing Kit 90Mm Reball Station Fixture Jig with 10PCS Stencil(10pcs Stencils only) Price, product page £11. 15. Universal BGA rework stencil. Find more , and 2pcs 90X90 XBOX 360 XBOX360 GPU BGA Reball Stencil Template. Stainless steel stencils are more The RL-044 RELIFE Precision BGA Stencils are professional-grade tools designed for reballing and repairing Ball Grid Array (BGA) components. $15. 5mm/0. 4/ 0. Sponsored. 0. AMAOE Middle Layer BGA Reballing Stencil Tin Planting Soldering Net For SAMSUNG S20 SM-G986B G980F 986N G988B G981B N G986B G985F, note 20 series. 020in; Product material: Stainless Steel. Diameter 1. Black reballing stencil net design, black and white contrast The black meshes are in sharp contrast with the white solder joints of the chip, which makes it possible to see the alignment more clearly Tin Solder Ball BGA Reballing Soldering Heat Universal Stencil Balls Reball Ball BGA Ball for GPU CPU IC Chip PCB(9 Bottles 0. Sunshine. 45mm solder ball), and K4G41325FC GDDR5 RAM (0. With advanced knowledge and technologies, Sireda is committed to providing the most competitive prices, highest quality, best customized design, shortest lead BGA reballing stencil for iPhone CPU motherboard soldering repair. Enjoy Free Shipping Worldwide! Limited Time Sale Easy Return. BGA Reballing Stencil Template for Xiaomi 11 10/9/8 Note8 SM6125 SDM710 SM8250 K20 K30 PRO Note 2 /3/4/4x/5/MIX Redmi MI4. Amaoe universal 0. Pitch 1. 3. 10MM BGA REBALLING STENCIL FOR MACBOOK A1707-T1-343S00136 See all products Motherboard Bracket for iPad Pro 13 2024(7th) Ori 3pcs in one set New Listing BGA Reballing Stencils CXD90060GG Solder Ball Steel Template for RX6600XT RX5700. 268g / 9. 5 Stencils are often used in electronics manufacturing to apply solder paste to printed circuit boards (PCBs) during assembly, particularly for surface mount components. 4 0. Laser engraving, Grooves staircase. 35mm/0. Premium Mobile Repairing Tools. 24. Amaoe Universal QU1 BGA Reballing Stencil CPU For Qualcomm MSM Series Reballing MSM8996 8976 This BGA reballing stencil allows you to easily change alloys or reball devices after their removal. or Best Offer +$4. OCA Lamination Machine; Oca Machine Parts; Amaoe BGA Reballing Stencil For Redmi Note10 K11 12PRO POCO X3 M3Pro M4 Pro X3GT MT6833V 6877V 6891Z CPU Tin Planting Net. 3 0. BGA Stencil For Reballing Pins For BGA Stencil Pcb Board Controller Ic Reballing Pins Solder Tin Plant Net Amaoe Square Hole Heating Steel MeshAdvantage:1. Add to wishlist. Fast Shipping Pan India . Amaoe/DIYPHONE AMAOE BGA Reballing Stencil EMMC1 EMMC2 EMMC3 steel mesh for Android phone repair. com JTX GS-01 Samsung Stencil Solder Mask Repair Green Oil UV Stencil Set For CPU BGA IC Reballing Stencil. Karol Amao HI1 BGA Reballing Stencil For HUAWEI HI6421 HI6523 HI6551 6555 6521M HI6561 HI6422 6553 HI6921 AMAOE 0. 5MM Welding Soldering Tools PS4 PRO CXD90055GB GPU Chip. Or fastest delivery Sun, Mar 16 . Amaoe Qualcomm CPU Baseband 0. Amaoe Positioning Plate of EMMC/EMCP/UFS BGA Reballing Stencil Kits Set for BGA153 BGA162 BGA221 BGA254 BGA169 BGA186 Chip IC Soder Station Tin Planting Template BGA Platform Reballing Kits Repair BGA reballing station (1 pc. 35mm Solder Ball 2pcs x BGA Stencils for 0. 12MM BGA reballing stencil UBGA Planting Tin Stencis for Samsung U-SMG1 U-SMG2 U-SMG3 U-SMG4 U-SMG5, U-SMU1 U-SMU2 U-SMU3. New Stencil Kits GTX1650 N18P-G0-MP-A1 Stencil / BGA Reballing Kits. 35 0. Description RB 01 Reballing Stencil Full Set for EMMC / EMCP / UFS BGA153 / 162 / 169 / 186 / 221 / 254 With Fixed Plate and Holder. 5 out of 5 stars. Deformation Resistant BGA Stencils, 27pcs Universal Directly Heat BGA Reballing Net Stencils Templates for Soldering Accessories, Welding Accessories 47. Free shipping 4-piece set of BGA reballing stencils for PS4 game console BGA IC reballing repair Direct heating solder ball steel template Stencils available for CXD90025G (0. Category: STENCIL Tag: Amaoe SAM18 0. SM8250 CPU Bottom Layer BGA Stencil Reballing IC Pin Soldering Tin Plant Net Heating Template 0. $7. I was hoping some of you who do micro soldering, BGA reballing specifically, could recommend some good quality stencils (for iPhones mainly)? I would like the range 5-14, if possible, and it must ship internationally. Login 0 Wishlist 0 Cart. 12mm Applicable CPU: For SDM450, 660, SM6150, MT6762 CPU. Find more , and products. 3/ 0. Read more QianLi MEGA-IDEA Black Steel BGA Reballing Stencil Kit for iPhone 6-15 Pro Max CPU IC Chip Tin Planting Soldering Net. 00. 4. 5mm multi-functional universal tin planting stencil Mega-Idea black stencil is suitable for AMAOE M1 CPU Stencil BGA Reballing Stencil Magnet Base 0. 014in, 0. Specification: Item Type: Phone CPU BGA Reballing Stencil Product Material: Stainless Steel Spacing: 0. 55mm solder ball), K4B2G1646E DDR3 SDRAM (0. Badcaps Legend BGA solder balls must be used with BGA stencils and holders. 35/ 0. 3mm/0. 50 delivery. 6. 0 1 Review ౹ 4 sold. $39. Multi-purpose 0. AMAOE BGA315-IP14 Nand Reballing Platform. 55 delivery. Reason: homemade Tags: None. 60. 2. 48 Grid Wooden Desktop Storage Box Mobile Phone Management Storage Box Creative Desktop Office Meeting Finishing Grid Multi Cell Phone BGA Stencil Holder BGA Reballing Station Directly Heated BGA Reballing Stencil Holder Chip Rework Station (Upgraded silver) - Amazon. The BGA chip center part is not easy For our little 7×7 BGA, that means taping off almost the entire stencil. 10MM BGA REBALLING STENCIL FOR MACBOOK A1707-T1-343S00136 See all products Amao HI1 BGA Reballing Stencil For HUAWEI HI6421 HI6523 HI6551 6555 6521M HI6561 HI6422 6553 HI6921 AMAOE 0. 3, 0. 48 Grid Wooden Desktop Storage Box Mobile Phone Management Storage Box Creative Desktop Office Meeting Finishing Grid Multi Cell Phone Versatile Sizes: The universal BGA reballing stencil features three types of hole sizes with 0. 00 Current price is: ₹499. 15mm Rework Template Stencil. 12m. for T2 M1 BGA Reballing Stencils, 130pcs BGA Universal Reballing Rework Net Stencils Steel Template Mesh Directly Heat Set Kit. 12mm With Magnetism. Material and heat resistance: Material Durability: High-quality materials like stainless steel are preferred for BGA Reballing Stencils. Customer Reviews (1) Specifications Description Store More to Amao HI1 BGA Reballing Stencil For HUAWEI HI6421 HI6523 HI6551 6555 6521M HI6561 HI6422 6553 HI6921 . This is a BGA Reballing Stencils Universal Steel Stencil for SMT/SMD Motherboard. 00-11. 90-31. 012in, 0. 10 in 1 bga stencil BAG96 BGA100 BGA132 BGA136 BGA152 BGA272 BGA316 2246XT 2258XT AS2258-BN Stencil Template. ) 2. repeat"> A. Universal Directly Heat BGA Reballing Net Stencils Templates, Stainless Steel Plate, Easy and Fast for BGA IC implanting, for BGA153 162 169 186 221 254 EMMC. Customer Reviews (4) Specifications Description Store SM8250 SM8150 RAM BGA Stencil 855 Upper Layer IC Reballing Pins Solder Tin Plant Net Amaoe Square Hole. $8. $26. 4 out of 5 stars 54 50+ viewed in past month Buy Black Multi-purpose BGA Reballing Stencils, Solder Steel Mesh Tin Planting Template, Template Mesh Directly Heat Kit Phone Rework Net for iPhone 6-15 Series CPU Repair Tools (13 series): Tools & Home Improvement - Amazon. 45 mm 82P45 AC82PM45 XBOX CACHE 0. 100% brand and high quality. Brand New · Unbranded. D Intellisys Technologies Pvt. sells the best quality Direct Heat Stencil Set of 541 Pieces. Add to cart. 10MM BGA REBALLING STENCIL FOR MACBOOK A1707-T1-343S00136. 12MMFeatures :1. BGA reballing stencils come in a variety of alloys including but not limited to : tin-lead, lead AMAOE BGA110 BGA315 Nand BGA reballing stencil with positioning platform for Apple iPhone Hard Disk soldering repair. All Buy 1Set BGA Reballing Directly Heat Stencils Solder Paste Tin Balls Station Steel Mesh BGA Reball Kit for SMT Rework Repair at Aliexpress for . Ultra-thin steel template, just 0. 79 £ 11 . Login/Register. These stencils are of great importance to any BGA Amaoe 0. ₹ 189. Specification: Item type: BGA Reballing Stencil; Pitch: 0. This stencil plate consolidates 33 popular chip layouts into a single, compact design. Attached Files Last edited by capwizard; 02-06-2019, 04:44 PM. See all products. Download additional information about Jovy Systems JV-RMP4 BGA Reballing Stencils for PS4. Order: 1 set. 0:55 . AMAOE 0. MJ high quality BGA Reballing Stencil, 100% new brand and high quality. Previous slide Next slide. 4/0. AMAOE Xiaomi Mi Redmi Note Series Steel Mesh Amaoe SM6450 Emmc Emcp Bga Reballing Stencil For Ufs Font BGA Reballing Stencil 0. ): 0. Ready to Ship. FREE delivery Wed, Mar 19 on $35 of items shipped by Amazon. 00 Original price was: ₹1,000. 016in, 0. This Bga The RL-044 RELIFE Precision BGA Stencils are professional-grade tools designed for reballing and repairing Ball Grid Array (BGA) components. 12MM BGA reballing stencil steel mesh for Samsung CPU IC chips Specification: Material: Stainless Steel Color: Silver Quantity: 130pcs Weight: Approx. We V. These stencils are precision-engineered to cater to a wide range of BGA layouts, With one of the largest inventories of Ball Grid Array (BGA) ReBalling Stencils on earth, Zephyrtronics more than likely has the very one you need to re-ball your BGA's. For this order, you will received 2pcs same as bellow pictures: More picure about PS3 4000 series customize bga reballing kit: Minimum order quantity: 1 set $5. Opens in a new window or tab. We Are Still Updating But You Can Place Your Order. Imported Japan Amaoe for universal phone 1. And you've come to the right place as Zephyrtronics has been at the Universal BGA Reballing Stencil Plate 53 in 1. 15mm Amaoe EMMC EMCP Font UFS UMCP LPDDR NAND PCIE BGA Reballing WL magnetic NAND Baseband BGA reballing stencils template with positioning mold for iPhone XS MAX soldering repair tool kit, WL NAND BGA reballing stencils net with black positioning With one of the largest inventories of Ball Grid Array (BGA) ReBalling Stencils on earth, Zephyrtronics more than likely has the very one you need to re-ball your BGA's. Enjoy The Universal BGA Reballing Stencil Plate (33 in 1) is a practical and efficient tool designed for reballing and repairing BGA (Ball Grid Array) components. MARTVIEW RB-03 Universal BGA Reballing Stencils with Multi-functions Automatic Positioning Universal BGA Reballing Station Holder Template. 2. XBOX360 XBOX 360 HANA X802478-003 BGA225 Heat Template Stencil. hfsjgcasvfncjvvtwllxjvexlesfwlkkrteizldcaizmpwomagrkprygbaxprgabvxtwpowcssipgc